| 1 |
IPCOM000083127D
prior art disclosure
|
Secure Document Feature for Copy Machines
The IBM Technical Disclosure Bulletin Vol. 15, No. 9, February 1973, at pages 2736 and 2737 describes an...
|
2005-Feb-28 |
| 2 |
IPCOM000083126D
prior art disclosure
|
Integration of Wireless Technology with Electrostatic Discharge Control Monitors and Statistical Process Control
Disclosed is a method that integrates commercially available electrostatic discharge (ESD) monitors and statistical...
|
2005-Feb-28 |
| 3 |
IPCOM000083125D
prior art disclosure
|
Measuring Diameter of a Laser Beam
This device, which may be hand-held, enables one to rapidly and accurately measure the diameter of a laser beam, and to...
|
2005-Feb-28 |
| 4 |
IPCOM000083124D
prior art disclosure
|
Method for a substrate with a recessed pad
Disclosed is a method for a substrate with a recessed pad. Benefits include improved functionality, improved...
|
2005-Feb-28 |
| 5 |
IPCOM000083123D
prior art disclosure
|
Tachometer Feedback in a Reel To Reel Control System
The system, as depicted herein, describes a reel-to-reel control system with control loops for enabling low-speed...
|
2005-Feb-28 |
| 6 |
IPCOM000083122D
prior art disclosure
|
Method for a TAB-SCSP
Disclosed is a method for a tape-automated-bonding stacked chip scale package (TAB-SCSP). Benefits include improved...
|
2005-Feb-28 |
| 7 |
IPCOM000083121D
prior art disclosure
|
Intrinsically Actuated Real Unit Operations for Virtual Unit Addressing
Common memory apparatus shared by a plurality of host CPU's, each host having an independent set of virtual address...
|
2005-Feb-28 |
| 8 |
IPCOM000083120D
prior art disclosure
|
Method of wafer-level underfill for copper bump technology
Disclosed is a method for wafer-level underfill for copper bump technology. Benefits include improved functionality,...
|
2005-Feb-28 |
| 9 |
IPCOM000083119D
prior art disclosure
|
Method for a through silicon via interconnect application on WB silicon
Disclosed is a method for a through silicon via interconnect application on wirebond (WB) silicon. Benefits include...
|
2005-Feb-28 |
| 10 |
IPCOM000083118D
prior art disclosure
|
Processor Checking
Satisfactory firmware (microcode) and hardware performances are checked for proper operation by program address...
|
2005-Feb-28 |