Month of March 2004

Showing 1 - 10 of 1388 results
Page: 1 2 3 4 5 ⟩⟩
No Document Title Date
1
IPCOM000023841D
prior art disclosure
High Performance Server Class Disk Drive packaged in a reduced size form factor
Current high performance server class disk drives used in the enterprise and workstation environment are all packaged...
2004-Mar-31
2
IPCOM000023840D
prior art disclosure
Method for timing test hooks for testing dynamic phase tracking interpolator-based receivers
Disclosed is a method for timing test hooks for testing dynamic phase tracking interpolator-based receivers. Benefits...
2004-Mar-31
3
IPCOM000023839D
prior art disclosure
Eutectic Solder Die Bump Application on Bump-Less Substrate Interconnects
Disclosed is a method that uses eutectic solder die bumps on the bump-less substrate C4 interconnects. These bumps are...
2004-Mar-31
4
IPCOM000023838D
prior art disclosure
Method to Prevent Damage and Enhance Design Performance of Logic Analyzer Interface Probes for mPGA-Packaged Micro-Processors
Disclosed is a method that uses a logic analyzer interface (LAI) probe assembly, an LGA/LGA-like connector, and a...
2004-Mar-31
5
IPCOM000023837D
prior art disclosure
V-Shaped Land Grid Array Contact Beam Design
Disclosed is a method for a land grid array (LGA) contact beam with two bending sections; the two sections are shaped...
2004-Mar-31
6
IPCOM000023836D
prior art disclosure
Thermal Loading Land Grid Array with Heat Sink Posts to Stiffen the PCB
Disclosed is a method that uses a heat sink with attached posts to stiffen a PCB under the CPU and socket. Benefits...
2004-Mar-31
7
IPCOM000023835D
prior art disclosure
Thermal Performance Enhancements for Small Form Factor Flip Chip Packages
Disclosed is a method that embeds a heat spreader on a package's surface during the molding process. Benefits include...
2004-Mar-31
8
IPCOM000023834D
prior art disclosure
Anti-Slip Design for Offset Die Stacking Using a Wafer-Level Redistribution Layer
Disclosed is a method that helps prevent silicon die from slipping when paste die attach materials are used to attach...
2004-Mar-31
9
IPCOM000023833D
prior art disclosure
Method for an automatic ergonomic desk
Disclosed is a method for an automatic ergonomic desk. Benefits include improved functionality.
2004-Mar-31
10
IPCOM000023832D
prior art disclosure
Method for a boat preciser with multiple precising pins
Disclosed is a method for a boat preciser with multiple precising pins. Benefits include improved functionality and...
2004-Mar-31