| 41 |
IPCOM000137890D
prior art disclosure
|
Method for moisture-diffusion holes in the substrate copper layer of LDI packages
Disclosed is a method for moisture-diffusion holes in the substrate copper layer of low-density interconnect (LDI)...
|
2006-Jun-29 |
| 42 |
IPCOM000137889D
prior art disclosure
|
Method for an elevated staggered die-bond pad in SCSP/PBGA technology
Disclosed is a method for an elevated staggered die-bond pad in stacked chip-scale package/plastic ball-grid array...
|
2006-Jun-29 |
| 43 |
IPCOM000137888D
prior art disclosure
|
Method for eliminating the die overhang gap in stacked-die CSPs
Disclosed is a method for eliminating the die overhang gap in stacked-die chip scale packages (CSPs). Benefits include...
|
2006-Jun-29 |
| 44 |
IPCOM000137887D
prior art disclosure
|
Method for using anisotropic conductive film for package stacking
Disclosed is a method for using anisotropic conductive film (ACF) for package stacking. Benefits include improved...
|
2006-Jun-29 |
| 45 |
IPCOM000137886D
prior art disclosure
|
Method for an integrated disposable tray locking mechanism
Disclosed is a method for an integrated disposable tray locking mechanism. Benefits include improved functionality,...
|
2006-Jun-29 |
| 46 |
IPCOM000137885D
prior art disclosure
|
Method for mercury strain gauges to measure package-board interconnect strain
Disclosed is a method for mercury strain gauges to measure package-board interconnect strain. Benefits include improved...
|
2006-Jun-29 |
| 47 |
IPCOM000137884D
prior art disclosure
|
Method for a Cu-stud substrate bump
Disclosed is a method for a copper-stud (Cu-stud) substrate bump. Benefits include improved functionality, improved...
|
2006-Jun-29 |
| 48 |
IPCOM000137883D
prior art disclosure
|
Method for electrochemical cells for corrosion testing of the components in IC liquid-cooling systems
Disclosed is a method for electrochemical cells for corrosion testing of the components in integrated circuit (IC)...
|
2006-Jun-29 |
| 49 |
IPCOM000137882D
prior art disclosure
|
Method for a corrugated paddle for a Si blind via hole
Disclosed is a method for a corrugated paddle for a silicon (Si) via blind hole. Benefits include improved...
|
2006-Jun-29 |
| 50 |
IPCOM000137881D
prior art disclosure
|
Method for a heat-compensation fixture for reflow soldering
Disclosed is a method for a heat-compensation fixture for reflow soldering. Benefits include improved functionality,...
|
2006-Jun-29 |