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Showing 1 - 10 of 407 results
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IPCOM000132653D
2005-Dec-31
In a manufacturing environment, RFID technology can be used to improve the process of making changes in equipment and materials for a grade change or other change in operation. Such changes are typically made according to a predetermined “recipe” that identifies the various hardware settings and raw materials that are...
IPCOM000132652D
2005-Dec-31
In a manufacturing environment, RFID technology can be used to improve the process of making changes in equipment and materials for a grade change or other change in operation. Such changes are typically made according to a predetermined “recipe” that identifies the various hardware settings and raw materials that are...
IPCOM000132651D
2005-Dec-31
Customers of drive-through fast food outlets often face the challenge of eating food without a convenient and rapid means of cleaning the hands prior to eating. Drive-through dispensing of food or dispensing of ready-to-eat food in general could be enhanced by routinely adding a convenient means of washing or...
IPCOM000132650D
2005-Dec-30
IPCOM000132649D
2005-Dec-29
IPCOM000132648D
2005-Dec-28
Disclosed is a method for early measurement of high-speed strip-line impedance circuitry. Benefits include improved functionality and improved performance.
IPCOM000132647D
2005-Dec-28
Disclosed is a method for package-level integrated electromagnetic absorbing adhesive for radio frequency (RF) packaging. Benefits include improved functionality and improved performance.
IPCOM000132646D
2005-Dec-28
Disclosed is a method for designing and attaching a fan shroud to CPU heat sink. Benefits include improved performance, improved reliability, improved ease of installation, and improved cost effectiveness.
IPCOM000132645D
2005-Dec-28
Disclosed is a method for package corner stress mitigation features and bend-line management. Benefits include improved functionality, improved performance, improved reliability, and improved cost effectiveness.
IPCOM000132644D
2005-Dec-28
Disclosed is a method for improved solder joint reliability of pads with microvias. Benefits include improved functionality, improved performance, improved reliability, and improved ease of manufacturing
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Showing 1 - 10 of 407 results
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