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Showing 1 - 10 of 380 results
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IPCOM000033183D
2004-Nov-30
Disclosed is a method for tolerating longer hit latency in the presence of larger mid-level caches with software cooperation and smaller single-cycle caches. Benefits include improved functionality and improved performance.
IPCOM000033182D
2004-Nov-30
The present disclosure relates to delivering a stable frequency reference from an incoming signal such that wireless communication can be accomplished with an implantable miniature device or microstimulator. The space limitations of a microstimulator restrict using a conventional quarts or other stable time base from...
IPCOM000033181D
2004-Nov-30
Disclosed is a method for solder mask crack termination grooves for a folded package. Benefits include improved functionality and improved performance.
IPCOM000033169D
2004-Nov-30
Disclosed are sunscreen formulations containing a 50% dispersion of micronized trisbiphenyltriazine. As emulsifying system a combination of cetyl phosphate and lecithin is used.
With this basic W/O formulation high galenical stability, good spreadability and nice application properties can be created.
Sunscreens based...
IPCOM000033153D
2004-Nov-30
Disclosed are specific compositions for hair-care applications which are useful for the protection of human and animal hair from oxidative degradation processes (photooxidation, autooxidation). The hair-protection actives in these compositions are selected from
(A) specific antioxidants,
(B1) benztriazole UV...
IPCOM000033152D
2004-Nov-30
A method is disclosed using nanowires to efficiently transfer heat from a component at higher temperature to a component at lower temperature. The approach demonstrates a thermal solution for future processors and ICs.
IPCOM000033150D
2004-Nov-30
IPCOM000033149D
2004-Nov-29
Disclosed is a method for distributed chemical sensing using integrated devices in cell phones. Benefits include improved functionality and improved performance.
IPCOM000033148D
2004-Nov-29
Disclosed is a method for a virtual thumb keyboard. Benefits include improved functionality, improved performance, improved usability, and improved design flexibility.
IPCOM000033147D
2004-Nov-29
Disclosed is a method for prepatterned solid film underfill (UF) with thermocompression bonding (TCB). Benefits include improved functionality, improved performance, improved reliability, improved process simplification, and improved throughput.
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Showing 1 - 10 of 380 results
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