| 41 |
IPCOM000032216D
prior art disclosure
|
Method for a BGA package with improved coplanarity
Disclosed is a method for a BGA package with improved coplanarity. Benefits include improved yield and improved...
|
2004-Oct-26 |
| 42 |
IPCOM000032215D
prior art disclosure
|
Method for a high performance, thin film TEC with minimal contact resistance
Disclosed is a method for a high performance, thin film thermoelectric cooler (TFTEC) with minimal contact resistances...
|
2004-Oct-26 |
| 43 |
IPCOM000032214D
prior art disclosure
|
Method for laser trimming of etch-resistive material for localized fine-feature patterning
Disclosed is a method for laser trimming of etch-resistive material for localized fine-feature patterning. Benefits...
|
2004-Oct-26 |
| 44 |
IPCOM000032213D
prior art disclosure
|
A Micro-Channel or Pin Grid Cooler Fabricated from Copper
Disclosed is a method for a copper micro-channel or pin grid cooler, which is created by electroforming a copper...
|
2004-Oct-26 |
| 45 |
IPCOM000032212D
prior art disclosure
|
Built-In ATE Power Supply Communicates Data from Current Measurement Unit to the Tester
Disclosed is a method that uses a built-in ATE power supply to relay current measurements from a standalone circuit or...
|
2004-Oct-26 |
| 46 |
IPCOM000032211D
prior art disclosure
|
Method for photonically induced bottom up CVD fill
Disclosed is a method for photonically induced bottom up chemical vapor deposition (CVD) fill. Benefits include...
|
2004-Oct-26 |
| 47 |
IPCOM000032210D
prior art disclosure
|
Reducing Wafer-to-Wafer Mean Thickness Variability on CVD Processes Using Novellus Vector Tools
Disclosed is a method that uses a multi-pedestal chamber to improve the wafer-to-wafer mean film thickness. The...
|
2004-Oct-26 |
| 48 |
IPCOM000032209D
prior art disclosure
|
New Formulation of Spin-On Dielectric for STI-Related Applications
Disclosed is a method that uses SiO2 nano-particles (i.e. silica) in the spin-on dielectric (SOD) for STI applications....
|
2004-Oct-26 |
| 49 |
IPCOM000032208D
prior art disclosure
|
Reducing the Thermal Budget and Annealing Temperature of Spin-On Dielectrics For STI-Related Applications
Disclosed is a method that applies radiation treatments (e.g. E-beam, UV, or Plasma) in association with thermal curing...
|
2004-Oct-26 |
| 50 |
IPCOM000032207D
prior art disclosure
|
Passive De-Gas Unit for Photo Resist
Disclosed is a method for a passive de-gas unit for photo resist, which removes dissolved or micro-entrained/suspended...
|
2004-Oct-26 |