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Month of October 2004

Showing 31 - 40 of 362 results
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IPCOM000032241D 2004-Oct-26
Disclosed is a method for a protocol extension for a standard management interface for IEEE 802.3. Benefits include improving the initialization speed of ports in a multi-port device.
IPCOM000032240D 2004-Oct-26
Disclosed is a method that uses a hard drive with a limited processing core to do virus scans while the drive is operating normally. Benefits include increasing protection from viruses without increasing the overhead of active scans on the host system CPU.
IPCOM000032239D 2004-Oct-26
Disclosed is a method for an algorithm that improves the read-request file transfer of physical RAID mirrors. Benefits include improving performance up to the limit of the number of devices on the controller bus, and the maximum transfer rate of the bus.
IPCOM000032223D 2004-Oct-26
In DB2 UDB v7.1, it is possible to create tables with columns that are of a structured type. Data in these columns are stored using an efficient embedded storage mechanism coupled with runtime codes that can process the storage format.
IPCOM000032222D 2004-Oct-26
Disclosed is a method for a new multi-core wire with an inner layer of Nickel and Copper, and an outer layer of Gold. Benefits include improving wire bond strength.
IPCOM000032221D 2004-Oct-26
Disclosed is a method which uses a built-in ATE power supply to extend the output power capability of an existing ATE device under test (DUT), while maintaining compatibility with existing test applications interfaces.
IPCOM000032220D 2004-Oct-26
Disclosed is a method that uses a low pass filter and voltage controlled oscillator to emulate a cooling fan for functional test purposes. Benefits include a solution that is more durable and costs less than a fan assembly.
IPCOM000032219D 2004-Oct-26
Disclosed is a method that uses an integrated spring-loaded BGA socket cover to reduce load on the package-to-board interconnect, and provide increased mechanical loads.
IPCOM000032218D 2004-Oct-26
Disclosed is a method that uses a functionally-graded low Coefficient of Thermal Expansion (CTE) organic substrate that contains inorganic fillers; these fillers have negative thermal expansion in the substrate core, and on the front side alternative build–up films (ABF). Benefits include reducing thermal and...
IPCOM000032217D 2004-Oct-26
Disclosed is a method for solder joint microstructure manipulation to increase reliability through particulate additions to solder alloy paste. Benefits include improved functionality, improved performance, and improved reliability.
Showing 31 - 40 of 362 results
<< < Page: 2 3 4 5 6 7 8 > >>