- 2013
- May
- April
- March
- February
- January
- 2012
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2011
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2010
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2009
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2008
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2007
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2006
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2005
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2004
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2003
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2002
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2001
- December
- November
- October
- September
- August
- July
- June
- May
- April
- March
- February
- January
- 2000
- December
- November
- October
- September
Press Esc to dismiss this message
Month of January 2004
IPCOM000021647D
2004-Jan-28
Disclosed is a method for real-time special illumination of three-dimensional (3-D) polygonal objects using a simplified ray-tracing technique. Benefits include improved functionality, improved performance, and improved ease of implementation.
IPCOM000021645D
2004-Jan-28
Disclosed is a method for attaching a heatsink to a heat spreader. Benefits include improved functionality and improved reliability.
IPCOM000021644D
2004-Jan-28
Disclosed is a method for a metal frame support for a Joint Electronic Devices Engineering Council (JEDEC) standard plastic tray. Benefits include improved performance
IPCOM000021643D
2004-Jan-28
Disclosed is a method for non-photolithography circuit formation using xerography patterning. Benefits include improved yield and improved cost effectiveness.
IPCOM000021642D
2004-Jan-28
Disclosed is a method for a polymer-backed die overhang for stacked CSP packaging. Benefits include improved functionality and improved performance.
IPCOM000021641D
2004-Jan-28
Disclosed is a method for a hand tool for cable installation. Benefits include improved functionality, improved ergonomics, and improved yield.
IPCOM000021640D
2004-Jan-28
Disclosed is a method for a compressed port pitch, triple stack audio connector. Benefits include improved functionality and improved ease of manufacturing.
IPCOM000021639D
2004-Jan-28
Disclosed is a method for a double-ended contact integrated circuit (IC) socket. Benefits include improved functionality and improved reliability.
IPCOM000021638D
2004-Jan-28
Disclosed is a method for reinforced wire bonds. Benefits include improved functionality and improved performance.
IPCOM000021637D
2004-Jan-28
Disclosed is a method for attaching an integrated heater spreader (IHS) to an IC package utilizing a Cu carrier plate. Benefits include elimination of substrate carrier and reduction in manufacturing cost.
Copyright © 2009-2013 IP.com. All rights Reserved.
@ipdotcom