Month of May 2003

Disclosed is an electroless plating method to repair barrier or liner defects in interconnect structures with copper wiring. The method is defect-localized in that it adds new barrier material only to places where Cu is exposed.

It is shown how the use of photosensitive dielectric materials can simplify the fabrication of certain air-gap-containg interconnect structures.

A modulated metal microstructure for improved wet etch taper control or for the formation of an interdigitated electrode for a capacitor is disclosed. Layers of a pure refractory metal, such as Ti, V, Cr, Zr, Nb, Mo, Hf, Ta, W, or alloys thereof are alternated with thin layers of the same refractory metal or alloy...

An image sensor includes a substrate for forming a support structure; a plurality of photosensitive areas disposed in a cavity of the substrate so that a lip is formed enclosing at least a portion of the photosensitive areas; and a light-transmitting tape having an adhesive side removably attached to the lip and...

A method for forming an abrasive particle matrix commences by forming a mixture of a silicon carbide (SiC) precursor resin and abrasive particles into a coherent mass. The coherent mass is pyrolized at a temperature below the thermal degradation temperature of the abrasive particles to convert the precursor resin...

This document defines two methods for wrapping an HMAC (Hashed Message Authentication Code) key. The first method defined uses a Triple DES (Data Encryption Standard) key to encrypt the HMAC key. The second method defined uses an AES (Advanced Encryption Standard) key to encrypt the HMAC key. One place that such an...

This invention describes the use of one or more FGPA blocks within a System On A Chip (SOC) to translate between different networking protocols. The fixed portions of the SOC such as a processor and memory controller then may be optimized for size, power, etc. This approach allows a single chip part number to be...