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Month of December 2002

Showing 31 - 40 of 195 results
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IPCOM000010583D 2002-Dec-19
This document describes TCP performance problems that arise because of asymmetric effects. These problems arise in several access networks, including bandwidth-asymmetric networks and packet radio subnetworks, for different underlying reasons. However, the end result on TCP performance is the same in both cases:...
IPCOM000010582D 2002-Dec-19
This memo defines a transport mapping for using the Simple Network Management Protocol (SNMP) over TCP. The transport mapping can be used with any version of SNMP. This document extends the transport mappings defined in STD 62, RFC 3417.
IPCOM000010581D 2002-Dec-18
Disclosed is a method for a thermal mechanical back plate (TMBP). Benefits include improved thermal performance, improved thermal resistance, and improved reliability.
IPCOM000010580D 2002-Dec-18
Disclosed is a method for the packaging/containment of processors for handling and shipment. Benefits include improved reliability.
IPCOM000010579D 2002-Dec-18
Disclosed is a method for a solder-lock retention fastener. Benefits include improved performance and improved reliability.
IPCOM000010578D 2002-Dec-18
Disclosed is a method for an improved coin-stack feeder to avoid part nesting of microelectronic package heatsinks. Benefits include improved reliability.
IPCOM000010577D 2002-Dec-18
Disclosed is a method for a solder preform as an interconnect for stacked multichip modules (MCMs). Benefits include improved functionality, improved throughput, and improved ease of manufacturing.
IPCOM000010576D 2002-Dec-18
Disclosed is a design method for a multidielectric capacitor. Benefits include improved reliability and improved cost effectiveness.
IPCOM000010575D 2002-Dec-18
Disclosed is a method for a stress-reduced flip-chip package by implementing a thin die and a flexible tape. Benefits include improved functionality and improved reliability.
IPCOM000010574D 2002-Dec-18
Disclosed is a method for molding thin microprocessor molded matrix array packages (MMAPs) for flip-chip dies. Benefits include improved reliability.
Showing 31 - 40 of 195 results
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