Month of September 2002

A flip chip interconnection system was developed using the following steps: I) sputtering a TiWNx barrier layer, (2) sputtering a Cu electroplating bus layer, (3) covering the whole wafer with photoresist, followed by development of photoresist to expose the bond pads, (4) electroplating a Cu stud on the sputtered Cu...

The specification of the alignment of the silicon crystal structure with respect to the ion beam direction is an important ion implant parameter. The ion beam orientation is commonly specified by the'tilt' and 'twist' angles. The tilt angle specifies the angle between the ion beam direction and the normal vector to...

Higher power resistors are desired in high power applications such as a power amplifier. Conventional rectangular screened chip type resistors have the typical hot spot in the center of the device. This hot spot thermally limits the device's operation and defines its dissipation rating. Currently, to increase this...

In a large-scale dispatch system, it is common for a dispatch controller to become fully loaded with subscribers. At this point, a new controller can be added to the system. When the new controller is added, subscribers are moved from the existing controller(s) to the new controller to allow for additional expansion...

The effect of Lower Control Voltages on insertion loss in GaAs Fet RF antenna switches is mitigated using a negative voltage derived from the transmitter output.

MEMS (micro electro-mechanical system) devices have been used previously to measure acceleration parallel to Cartesian coordinate axes (x, y, z). Similarly, rotational rates have been measured with respect to x, y, and z axes. MEMS acceleration sensors are typically comprised of differential capacitance parallel...

The design of the Thin Film Fuel Cell (TFFC) as proposed and detailed by C. Dyer (U. S. patents 4,863,813; 4,988,582; 5,094,928) is significantly different from conventional polymer electrolytic membrane (PEM) fuel cells. The TFFC impermeable solid substrate design operates in a mixed fuel/oxidant gas environment.

The effect of Lower Control Voltages on insertion loss in GaAs FEr RF antenna switches is mitigated using a negative voltage derived from the transmitter output.

A Pin Grid Array hermetic package (PGA) is used to house many different devices, including the 68000 series microprocessors, digital signal processors and RJSC. This type of PGA is a ceramic package with a gold only internal die cavity area which uses silver glass paste as the die attach material.

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