The chip input output (I/O) assembly components of a magnetic bubble module having a low noise level is shown in Figs. 1 and 2. The assembly contains a flexible plastic substrate 12 that has four equal areas 14 for external connections. A preferred material for the substrate 12 is a polyimide. The areas 14 have copper signal lines 16 which are in electrical connection to pins 18.
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Magnetic Bubble Memory Module With A Thin Media I/O Structure
The chip input output (I/O) assembly components of a magnetic bubble
module having a low noise level is shown in Figs. 1 and 2. The assembly
contains a flexible plastic substrate 12 that has four equal areas 14 for external
connections. A preferred material for the substrate 12 is a polyimide. The areas
14 have copper signal lines 16 which are in electrical connection to pins 18.
The flexible substrate 12 has an opening 20 therein suitable for a bubble chip
22 on a ceramic substrate 24 to be positioned thereon. Copper signal lines 26
connect the chip 22 to lands 28. The lands 28 are electrically bonded to the
lands 30 on the flexible substrate 12.
The x and y rotational coils (not shown) are wrapped around sections 32 and
34, respectively. The low noise level is a result of the signal path in areas 14
being outside of the x, y coils.
This type of chip I/O assembly may be used with either an open or a closed
bias structure in a bubble module.
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