Disclosed is a method for producing a heat pipe enhanced thin-fin mushroom heatsink. Benefits include improved thermal performance.
Method for producing a heat pipe enhanced thin-fin mushroom
heatsink
Disclosed is a method for producing a heat pipe enhanced
thin-fin mushroom heatsink. Benefits include improved thermal performance.
Description
The
disclosed method consists of a thin-fin mushroom heatsink designed to
incorporate cylindrical heat pipes. The mushroom heatsink concept maximizes the
available heat transfer area in the region surrounding the processor by
extending up and over the adjacent components (see Figure 1). However, in cases
where a mushroom heatsink has thin fins, the effectiveness of the outer fins is
reduced due to the distance that energy must be transported through the thin
fin material from the base to the overhanging fins.
By
incorporating heat pipes into the mushroom heatsink concept, the effectiveness
of these overhanging fins can be greatly improved by transporting energy
directly from the base to the overhanging fins through the heat pipes. Because
heat pipes have an extremely low effective thermal conductivity, energy may be
efficiently transported from the base to the fins with a relatively low
temperature drop. The dual or triple heat pipes are embedded into the base and
are mechanically attached to the fins. The overhand regions may be asymmetric (see
Figures 2 and 3) or symmetric (see Figures 4 and 5).
The
disclosed method works by creating various energy transport paths in a heatsink
to maximize fin effectiveness and minimize overall heatsink thermal resistance.
Energy from the processor ente...
