Currently there is a technology available that consists of attaching chip components on the solder F side of a PC. board, and discrete components on the component side of the P.C. Board. (See U.S. patent numbers 4,139,881 and 4,164,778).
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(fi> MOTOROLA Technlcal Developments Volume 3 March 1983
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD
By Torleiv Melkeraaen
STATEMENT OF PROBLEM
Currently there is a technology available that consists of attaching chip components on the solder F side of a PC. board, and discrete components on the component side of the P.C. Board. (See U.S. patent numbers 4,139,881 and 4,164,778).
In order to remain competitive in the RF oscillator market, new channel element designs make use
. of a P.C. board as a header (base) of the package.
The use of RF circuitry and components on the solder side of these P.C. boards is not recommend- ed because of lack of shielding and protection. Therefore, the RF circuitry and components must be placed on the component side of these P.C. boards.
Described below, are three current methods Of assembling P.C. boards using discrete and chip components.
(i' Motorola, Inc. 1983 1
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Volume 3 March 1983
TM\ MOTOROLA Technical Developments -i
METHOD 1
PRESENT FACTORY FLOW
Leaded Component Insertion From Top of Board, Chip Component Placement on Top of Board
VW
PCB TRACE ANALYZER HORTSlOPENS TESTING
i STOCKROOM
A
SCREEN SOLDER PASTE
+
CHIP COMPONENT PLACEMENT
1
INSPECT c INFRARED REFLOW SOLDER t
CLEAN
I
B
t CHIP COMPONENT PLACEMENT
INSPE:TION
t INVERT BOARD t FLUX/INCLINED WAVE SOLDER
b CLEAN t INVERT BOARD
i
DIP COMPONENT INSERTION t
AXIAL COMPONENT INSERTION
fl RADIAL COMPONENT INSERTION
+I FLUX/INCLINED WAVE SOLDER
cl CLEAN
+I HP3060 ATE BOARD TEST
BACK-ENti QUEUE
ALTERNATIVE (B) PREFERRED
to! Motorola, Inc. 1963 2
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m
MOTOROLA Technical Developments Volume 3 March 1983
METHOD 2 PRESENT FACTORY FLOW
Chip Components (Only) on Top and Bottom Board
VW i PCB TRACE ANALYZER SHORTS/OPENS TESTING c
STOCKROOM
A
t SCREEN SOLDER PASTE I CHIP COMPONENT PLACEMENT
c INSPECTION
INFRARED REFLOW SOLDER 4
CLEAN
I INVERT BOARD
I B
-t CHIP COMPONENT PLACEMENT
TV INSPECTION c INVERT BOARD t FLUX/INCLINED WAVE SOLDER
+
CLEAN
b CHIP COMPONENT PLACEMENT
4
INSPECTION
1
INVERT BOARD
I
SOLDER
FLUX/INCLINED WAVE
;
CL AN
HP3060 ATE HOARD TEST
b BACK-END QUEUE
ALTERNATIVE (B) PREFERRED
ix ) Motorola. inc. 1983
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:M MOTOROLA Technical Developments --~~_
Volume 3 March 1983
METHOD 3
PRESENT FACTORY FLOW
Leaded Component Insertion From Top of Board, Chip Component Placement on Top and Bottom of Board
PCB TRACE ANALYZER SHORTS/OPENS TESTING
STOCK)ROOM
SCREEN SO)LDER PASTE #
CHIP COMPONENT PLACEMENT
t INSPECT
#
REFLOW SOLDER
t CLEAN
t DIP COMPONENT INSERTION
AXIAL COMPOf!ENT INSERTION
RADIAL COMPOkENT INSERTION
INVER!BOARD
CHIP COMPON:NT PLACEMENT
t INSPECTION
INVER:BOARD
FLUXllNCLfNDEtD WAVE SOLDER
t CLEAN
t HP3060 ATE BOARD TEST
b B...
